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Method for inspecting a BGA joint

建立日期：2018/02/21
  • 作者： Teradyne
  • 出處： USPTO-美國專利商標局
  • 內容： 本篇內容為Teradyne於March 14, 2006 獲證之美國專利，下文為專利摘要，專利全文請連結參考網址，瀏覽專利全文所需看圖軟體請至 http://www.alternatiff.com/ 下載。

    [Abstract]
    An inspection method utilizing vertical slice imaging. A number of horizontal slice images, extending through an object of interest, are acquired. A vertical region of interest is defined from the data representing the horizontal slice images. A vertical slice image is constructed based upon the horizontal slice image data falling within the vertical region of interest. The vertical slice image data may be analyzed to detect defects. In addition, a method is provided to detect defects in a BGA joint. The method includes locating a center of the joint. The method may further include measuring a number of diameters through the center of the joint and applying a rule to compare the measured diameters to an expected diameter.

    [FIELD OF THE INVENTION]
    The present invention relates generally to printed circuit board inspection techniques, and more particularly to a method and apparatus for inspecting interconnections on or within circuit boards utilizing vertical slice imaging techniques.

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