top

知識分享

Inspection data producing method and board inspection apparatus using the method

建立日期：2018/02/21
  • 作者： Omron
  • 出處： USPTO-美國專利商標局
  • 內容： 本篇內容為Omron於July 29, 2008 獲證之美國專利，下文為專利摘要，專利全文請連結參考網址，瀏覽專利全文所需看圖軟體請至 http://www.alternatiff.com/ 下載。

    [Abstract]
    After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window W4 making up a reference for setting other windows is binarized, and lands 35 on this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows W1 for solder inspection are corrected, after which the set positions of other inspection windows W2 to W4 are corrected.

    [FIELD OF THE INVENTION]
    The present invention relates to a technique of processing an image obtained of a board with parts mounted thereon (hereinafter referred to as ""the parts mounted board"") and inspecting the soldered state of parts on a board and the mounted state of parts and electrodes on the board, or in particular to a technique for producing inspection data for this type of inspection.

回上頁