技術專欄 - 知識分享 - AOIEA 自動光學檢測設備聯盟

建立日期：2018/02/21

作者： 彭德保等
出處： 交通大學工工管系彭德保、李恕明、周正全
內容： In this paper, a vision system that can auto-inspect the correctness of the wire bonding position of leadframe ICs automatically was proposed. The proposed system can fully solve the overkill and missing problems that occur in wire bonding process. A new vision inspection method that integrates image processing and the bonding position check (BPC) technique was proposed. Experimental results show that the proposed system is robust and fast enough to be applied for inspecting the leadframe IC synchronously with the wire bonding process.

論文全文請詳附加檔案連結說明。
檔案下載：Vision Inspection of Wire Bonding Position of Lead
下載次數：2580