晶圓表面形貌量測技術

晶圓表面形貌量測系統是利用光偏折原理，由相機擷取晶圓上的條紋影像，並應用相位移及相位展開技術量測條紋變形量，即可測量出晶圓表面斜率變化及表面形貌，並可分析晶圓之翹曲及薄膜應力，本技術可扣除重力影響，重現樣本最真實的翹曲值。

The wafer surface topography measurement system utilizes the principle of light deflection, where a camera captures fringe images on the wafer. By applying phase-shifting and phase-unwrapping techniques to measure fringe deformation, the system can determine surface slope variations and surface topography. It also allows for the analysis of wafer warpage and thin-film stress. This technology can eliminate the effects of gravity, providing the most accurate representation of the sample's true warpage.