晶圓表面形貌及粗糙度量測技術

白光干涉儀量測模組採用低相干干涉原理，利用寬頻白光源照射樣品，並透過干涉條紋的相位與強度分析，獲得奈米級的三維表面形貌與高度資訊。本技術具備非接觸、高精度與快速量測等特性，特別適用於半導體晶圓表面形貌及粗糙度等參數量測。

The white light interferometer module uses low-coherence interferometry, where a broadband light source illuminates the sample and interference fringe phase and intensity are analyzed to obtain nanometer-level 3D surface profiles and height information. Featuring non-contact, high-precision, and fast measurement, it is ideal for wafer topography, and roughness measurement。