3D X-ray電腦斷層量測技術

透過高解析度微米/次微米級X-ray電腦斷層掃描技術，非破壞性解析待測物內部三維微結構與幾何形貌。透過高精度轉台旋轉投影與重建演算法進行3D體積重建，可精準量測內部孔洞分佈、壁厚均勻性、組裝間隙及幾何尺寸與公差等關鍵尺寸，為先進封裝、精密元件研發驗證與製程品質管控提供高精度、非破壞性檢測解決方案。

Based on high-resolution micro/sub-micron X-ray computed tomography (XCT), this system provides non-destructive 3D reconstruction of internal microstructures and complex geometries. By capturing multi-angle X-ray projections and applying reconstruction algorithms, it enables precise quantitative analysis of porosity distribution, wall thickness, assembly tolerances, and geometric dimensioning and tolerancing features, serving as an effective inspection tool for advanced packaging R&D and manufacturing quality assurance.